Proudly made by Bare Board Consultants

 Production Capability

The development of our management system has proceeded through different stages in order to ensure efficient design and control. Every workflow was analyzed in order to determine which activities needed control and estimate specific risks for each activity. Based on the results we designed required routines.
 

Layer count

 1 Layer - over 24 Layer

Blind via Hole

 yes

Buried hole

 yes

HDI – Filled copper

 yes

Surface Finish

 Electroplating Gold flash              

 ENIG

 Hot- Air- Leveling  (Sn/Pb and LF HAL)              

 OSP

 Immersion Silver   Immersion Tin

Available laminate

 CEM-1,  CEM-3,  FR-4

 Getek,  PTFE,  25FR

 FR4 + 25FR

 FR4 + Getek

 FR4 + PTFE

 Rogers  - Megtron

 Polyclad  - Aluminum

Material supplier

                             

 Shengyi, Isola, Arlon,

 King Board, TUC, Taconic, Totking, Nelco, ITEQ

                               Feature

Condition

Production

Structure

Board Thickness

Minimum

14 mil

 

 

Maximum

120 mil

 

Sequential Build-Up

1+N+1/2+N+2 3+N+3

 

 

Sequential Lamination

N+N,N+N (Microvia)

 

 

Via in Pad

Filled by Cu Paste

YES

 

Capped PTH

 

YES

 

Laser Via filling

Filled by Cu Paste

YES

 

 

Filled by Plating

YES

 

Copper Foil

Outer Layer

1/3 oz – 5 oz

 

 

Inner Layer

1/3 oz – 3 oz

Solder Mask

Solder Mask Dam

Minimum

3 mil

 

Solder Mask Opening

Minimum

1.5 mil

Dielectric Thick.

SBU Dielectric Thickness

Minimum

1.5 mil

 

 

Maximum

5 mil

 

IVH Core Thickness

Minimum

4 mil

 

 

Maximum

100 mil

 

Core Thickness

Minimum

2 mil

 

Dielectric Thickness (Prepre)  

Minimum

2 mil

Hole Formation  

Mechanical Hole

Minimum

6 mil

 

IVH Hole Size

Maximum

16 mil

 

Laser Hole Drill Size

Minimum

3 mil

 

 

Maximum

8 mil

 

Pad Size (Mechanical Hole)

Inner Layer

Drill + 8 mil

 

 

Outer Layer

Drill size + 6 mil

 

 

Inner Layer Clearance  

Drill size + 12 mil

 

Pad Size (Laser Hole)

Target Pad

Drill Size + 6 mil

 

 

Capture Pad

Drill Size + 6 mil

                                          Feature

Condition

Production

Dimension Toler.   

Board Thickness

≤ 20mil

+/- 2 mil

 

 

> 20mil

+/- 10%

 

Bow & Twist

 

0.75%

 

Fiducial Mark to Fiducial Mark

 

+/- 1.5 mil

 

Hole to Hole

 

+/- 3 mil

 

Hole to Edge

 

+/- 5 mil

 

Edge to Edge

 

+/- 4 mil

Laser process

CO2 Direct Drill

Conform Mask

 

Registration Cap.

 

Layer to Layer

 

 3 mil

Electrical/RF Cap.

Min. Line Width/Spacing

Inner Layer (1/2oz)

 2mil / 3mil

 

 

Inner Layer (1oz)

 

 3mil / 3mil

 

 

Outer Layer

 3mil / 3mil

 

Impedance Control

 

 +/- 10%

Plating Capability

Aspect Ratio

Mechanical Through Hole

 12:1

 

(Depth:Diameter)

Laser Blind Via

  1:1

Unfortunately, PCBs cannot simply be bought off the shelf. If you are aware of the many stages required in the production of a PCB, you will know that it is indeed a long and complex process.

 

1.

Filmwork

 

13.

Etching

2.

Material preparation

 

14.

Quality Control

3.

Mounting holes & pinning           

 

15.

Tin Strip

4.

CNC drilling

 

16.

Brushing / Copper plating

5.

Brushing plating

 

17.

Soldermask application

6.

Electroless copper plating

 

18.

Soldermask exposure

7.

Brushing / resist

 

19.

Soldermask development

8.

Laminating resist

 

20.

Burn in

9.

Exposing resist

 

21.

Hot Air Levelling

10.

Developing resist

 

22.

Pinning

11.

Tin lead Plating

 

23.

Routing

12.

Drying

 

24.

Final quality checks